Samsung is researching new chip packaging technology to reduce AP overheating

Samsung Electronics is reportedly developing a new packaging technology to combat overheating in mobile application (AP) processors, which may be applied to its next-generation Exynos processors by the end of 2024.

Samsung is developing a new chip packaging technology called HPB package (FOWLP-HPB) to prevent application processors (APs) from overheating. This technology involves installing a thermal path block (HPB) on top of the SoC and is expected to be used in future Exynos chips.

The Advanced Packaging Division (AVP) of Samsung's chip division is leading the development of FOWLP-HPB and plans to complete it by the fourth quarter of 2024, after which mass production will begin. Samsung is also working on its FOWLP system-in-package (SIP) technology, which can house multiple chips, and plans to launch it in the fourth quarter of 2025.

Both FOWLP-HPB and FOWLP-SIP place the HPB on top of the SoC, with the memory next to the HPB. HPB, a heat sync generally used in server and PC SOCS, has been introduced on a smartphone to increase heat tasks, especially due to the adoption of on -device AI.