Saturday, November 23rd
    Jul 17

    Generac, a home generator provider, has now released an electric car charger

    Generac, a leading energy and power management company, has launched its first electric vehicle charger, the Generac Level 2.

    Jul 15

    Complaints regarding crashing 13th and 14th generation Intel CPUs now have data backing them up

    Alderon Games is replacing servers with AMD due to serious instability issues with 13th and 14th-generation Intel processors.

    Jul 15

    AMD delves deeply into the architecture for AI PC CPUs

    AMD has revealed details of its latest AI-PC architecture, including a new neural processing unit (NPU) in its Ryzen AI chips.

    Jul 13

    Game developer accuses Intel of marketing 'defective' Raptor Lake processors

    High-end CPU instability, frustrations, and failures drove one studio to move to AMD.

    Jul 11

    Neuralink Brain Chip Implant Wires are now stable in the first patient, and Musk hopes for more human trials this year

    Neuralink is investigating an implant that will allow paralysed individuals to use digital gadgets by thinking alone.

    Jul 11

    The smart home energy innovation startup has switched to Good Energy

    Myenergi, a smart home energy technology company, has switched its energy source for headquarters and production to Good Energy.

    Jul 09

    Audits will be conducted on every internet-facing technology

    Australian federal government agencies are being subjected to a series of cyber security audits, driven by a growing fear of foreign interference.

    Jul 09

    Azqore used Volante Technologies' PaaS technology for SEPA fast payments

    Swiss bank Azcor plans to integrate PaaS technology from Volante into its core banking infrastructure to comply with the European Commission's SEPA instant payments mandate.

    Jul 09

    Trial production of Apple's next-generation chip technology will begin next week

    Apple is set to transition to a 2nm process for its custom silicon in 2025, boosting performance and reducing power consumption.

    Jul 09

    Samsung is researching new chip packaging technology to reduce AP overheating

    Samsung Electronics is developing a new chip packaging technology called HPB package (FOWLP-HPB) to prevent overheating in mobile application processors.